Penn State to Face Florida in 25th Anniversary Outback Bowl

December 30, 2010

The Penn State Nittany Lions and Florida Gators will square-off in the 25th Anniversary Outback Bowl on New Year’s Day.

“When you talk about tradition and history of college football it just doesn’t get any better than Penn State and the University of Florida,” said Outback Bowl President/CEO Jim McVay. “It’s our 25th anniversary game and we can’t think of a better way to celebrate it on New Year’s Day than with Coach Paterno’s Nittany Lions and Coach Urban Meyer’s Gators.”

“The Gators and Nittany Lions, this is a dream match-up between two of the most storied programs in all of college football,” adds Bowl Chairman Mitch Shriber. “This should be a great one!”

The Outback Bowl will be played on January 1st at 1:00 PM at Raymond James Stadium.

Lori Shontz, senior editor of the Penn Stater Alumni Magazine, wrote an excellent article in her blog about Penn State’s school mascot, the Nittany Lion.  Recently, the shrine underwent digital 3D scanning, which will enable it to be rebuilt or repaired in the event of severe damage.   The university wanted to be able to preserve the 70 year-old sculpture, a gift from the senior class of 1940. This way, if any damage were ever inflicted on the mascot, Penn State could recreate the Lion from the 3D CAD model. They decided to bring in professionals from SURVICE Metrology. SURVICE Metrology is a close partner of Nikon Metrology and they used a Nikon Metrology Optical CMM to scan this beast of a mascot. Now that this project is complete, there are plans to possibly animate the mascot.

Click here to read more on this by Lori Shontz


Who wins the battle of the Christmas lights?

December 25, 2010

The house on the right……………that’s my style!

    


Christmas Lights: Wizards in Winter

December 24, 2010

For your viewing pleasure, here’s a really great video of Christmas lights, set to music.  Enjoy, and   

Happy Holidays from everyone here at Nikon Metrology! 

 

Imagine the metrology that must go into putting together a display like that………………..!


Measure Before Machining & Avoid Errors

December 23, 2010

Die Tech avoids errors by inspecting electrodes prior to EDM

by Peter Zelinski, Senior Editor of Modern Machine Shop

A laser scanning head measures an EDM electrode.

Here, the EDM machine produces a simple hole. The combination of palletization and automatic EDM programming makes this approach more efficient than using a drill press.

Despite Die Tech & Engineering’s investment in machining centers, the shop still does plenty of sinker EDM work. Using EDM electrodes in a tight-lead-time process is “scary,” says president William Berry, because of the risk of error. An error in milling a complex graphite electrode, or in programming it at the machine, might not be detected until the EDM cycle has made a faulty part.

From Mr. Berry’s perspective, a coordinate measuring machine never made sense. Inspecting a part after machining adds no value, he says. Instead, when the shop finally did buy a CMM, it was for inspection before machining. Specifically, all EDM electrodes in the shop—hundreds of electrodes per week—now pass across a non-contact laser scanning head from Nikon Metrology, mounted on a Brown & Sharpe CMM.

Here, the EDM machine produces a simple hole. The combination of palletization and automatic EDM programming makes this approach more efficient than using a drill press.

Verifying electrode geometry in this way costs little lead time. Electrode CMM inspection programs are generated automatically. In fact, DTE has engineered its system to create EDM machine programs automatically as well, so every electrode is used correctly, without human error.

This electrode process, combined with palletization, has produced some counter-intuitive economies for the shop. I saw an example while visiting. In the photo seen here, a sinker EDM is used to produce a simple hole that, by any intuitive guess, ought to be drilled. However, Mr. Berry points out that the only savings drilling can offer would be cycle time. A human would still have to run the job on a drill press or machining center. By contrast, DTE’s EDM process is so seamless that there is no harm in letting an EDM machine produce the hole if an EDM machine happens to be available. Doing this frees employees to devote their attention to higher-value tasks.

 

 Click here to read this article in Modern Machine Shop.


Cross Scanners Automate Inspection of “Christmas Trees”

December 20, 2010

3D digitizing and point cloud processing drive a digital inspection process that drastically improves CMM productivity while accelerating design-through-manufacturing by providing full geometry feedback. Customers in automotive, aerospace or general manufacturing industries use this exciting technology to speed up their inspection process.

Benefits of 3D digitizing

  •  3D digitizing results in a complete digital copy within minutes
    • 3D scanning enables complete inspection and modeling of complex freeform, multi-filleted or featured parts.
    • Using traditional touch probes measuring complete parts can take hours or even days
  • 3D digitizing is a non-contact measurement technology
    • 3D  scanning  is  suited  for  measuring  flexible  or  fragile  materials, often  a  challenge for  touch  probes  due  to  the  risk  of  indentations  or  surface scratches.
  • 3D digitizing is fully compatible with touch probe technology
    • The operator can easily switch between laser probe and touch probe maintaining all existing functionality  of  the  coordinate  measuring  machine  (CMM).  In  addition  it  is  possible  to combine touch probe alignments and scanner measurements.
  • 3D digitizing shortens the development cycle and improves product performance
    • Once a digital copy of the prototype has been acquired, product verification, engineering
    • analysis  and  other  functions  can  take  place  concurrently  by  OEM’s  and  suppliers  at different locations.
  • A tightly integrated 3D digitizing solution from digitizing to inspection or reverse engineering
    • Using  a  whole  product  approach  reduces  the  total  measurement  and  analysis  time, hence increasing efficiency of the inspection process and reducing costs.

 


XC65D digital laser scanner 1
3D scanning of sheet metal with digital Cross Scanner XC65D
Contact us regarding questions about 3D digitizing

or learn more by continuing reading…

Getting more out of your CMM with 3D digitizing
 

Limitations of tactile inspection
Sheet metal spring back and plastic part shrinkage illustrate that product quality concerns the entire shape of parts and not just a few geometric features. Even for a limited number of measurement points, CMMs require considerable programming overhead. In addition, tactile measurement falls short on soft and fragile parts. Economic pressure and higher quality standards force the metrology department to provide more detailed geometric information in less time.
To a certain extent, 3- and 5-axis tactile scanning overcomes the limitations of discrete touch trigger measurements. High-speed bridge CMMs equipped with this advanced touch sensor speed up dimensional inspection on prismatic driveline parts. Characterizing a drilled hole by scanning a spiral line on its bore surface reveals much more valuable information than 4 discrete points. Also on the aerofoil surface of a turbine blade and other freeform surfaces, 5-axis analog scanning is an improvement compared to traditional tactile inspection. Although analog scanning provides much more data, elaborated CMM programming is required to ensure that the probe tip continuously follows the part surface without colliding with the part or the CMM structure.
 
 
 

 

Digital Laser scanner LC60 digitizing sheet metal part LC60D digital scanner for inspection, casting, software
LC60D Digital line scanners reconciles high point cloud density with tremendous 3D scanning speed.  Graphic part-to-CAD comparison charts highlight local geometry deviation resulting from 3D scanning

3D digitizing technology boosts measurement productivity

The sensor that undoubtedly gets most out of a CMM is a non-contact 3D laser scanner. New innovations in 3D scanning technology and point cloud processing software are key enablers of an entirely digital inspection process. The concept of digitizing parts up-front and running inspection on the digital copies of the samples streamlines metrology operations and embeds them into the CAD-centric design-through-manufacturing process. From measurement preparation to final report, this approach is significantly faster, provides more profound insight, and takes advantage of the typical flexibility and automation benefits of a digital process.
A 3D laser scanner essentially projects a precision laser stripe on a specimen while its built-in digital camera captures the projected laser line under a fixed angle. Today’s digital 3D scanners with advanced CMOS camera technology offering impressive point resolution and image acquisition rates, capture over 75.000 non-interpolated points per second. As they reconcile high point cloud density with tremendous scanning speed, they accurately digitize freeform surfaces and geometric features at high speed. Line scanners such as LC15 with a smaller field of view suit detailed inspection of smaller parts by offering measurement accuracy down to 5 micron.
To effectively scan surfaces with varying color or high reflectivity, digital laser scanners dynamically adapt laser source intensity point-per-point. This capability is essential in dealing with different sample materials and surface finishes without operator interaction or powder spraying, also for shiny surfaces and abrupt transitions under any lighting condition. Intelligent intensity adaptation helps automatically scan similar parts in different manufacturing stages; initially dealing with bare sheet metal parts and finally scanning finished products painted in any color.
 
 
 

 

XC65D digital laser scanner 3 3D scanning - Focus Scan Offline dashboard
By observing a part from 3 directions, a cross scanner captures complex surfaces and features in a single scan. Scan paths for 3D scanning are easily generated with a click of the mouse A scan macro is automatically generated in Focus Scan using point cloud simulation.

Multi-line scanners capture full 3D geometry in a single scan

Line scanners may be stretched to their limits when digitizing parts with more complex surface shapes or numerous geometric features. For such applications, manufacturers better opt for a multi-line scanner, known as the Metris Cross Scanner that incorporates 3 lasers in a cross pattern. These scanners realize full coverage on extremely concave surfaces, in between ribs, and inside the cavities of deep pockets. By observing geometric features from 3 sides, a cross scanner is able to digitize the bore of a hole or the flanges of a notch in a single scan.
A cross scanner enables full 3D digitizing of features like slots, notches and edges as well as specialized geometric features, including connection pins, welded bolts and T-studs. Where tactile measurement relies on a handful of accurate points to define the orientation of an elongated feature, optical inspection does a better job by fitting lines through hundreds of points acquired along the feature flange. In this way, geometric features can be extracted from the acquired point cloud with higher confidence and accuracy.
 
 
 
 

 

XC65D digital laser scanner 2 Connection features for automotive sheet metal
By digitizing the full geometry of complex “Christmas tree” features, car manufacturers verify the positioning of these features multiple times faster.

3D scanning drastically reduces required CMM time

Thanks to high 3D scanning speed and short scanner motion paths with limited or no head indexing, laser scanners digitize freeform surfaces and geometric features in a fraction of the time.
At car manufacturers, cross scanners automate the inspection of so-called “Christmas tree” features. Robots weld these complex metal features on sheet metal body parts to allow trim to be easily and securely connected by means of screws. In roughly 5 seconds, a cross scanner digitizes the complete geometry of a single Christmas tree feature in order to determine its actual welding position. Scanning avoids spending hours manually mounting cylindrical extensions on the Christmas trees required for tactile measurement and removing them afterwards. With laser scanning, the entire CMM inspection process is executed more than 10 times faster.

High standoff distance and field-of-view depth enable cross scanners to realize major time savings when inspecting automotive casted parts. To take a full 3D scan of one side of an engine block, cylinder head or gearbox cover, the CMM only needs to move the scanner along parallel motion paths without indexing the head. With such limited CMM overhead, the scanner captures the complete surface, including full 3D characteristics of ribs, holes, flanges and pockets, at record speed. One hour is sufficient to set up and execute inspection, whereas detailed tactile inspection easily lasts more than a day.

visit www.nikonmetrology.com to learn more.
 
 
 

 


Wishing you a Happy Holiday Season!

December 16, 2010


Study: Comparison Between Photogrammetry and Laser Radar

December 15, 2010

Use of Laser Radar reduces recurring labor required to characterize surface profile of reflectors

As reported in Quality Digest and CMSC World

At the Harris Corp. (Government Communications Systems Division—GCSD), solid carbon-fiber and aluminum-shaped reflector dishes are manufactured to support military ground, sea, and air communications. These reflectors range in size from 1 to 13 m. To meet performance requirements, the surface profiles of these reflectors are held to rigid tolerances. For 25 years, photogrammetry (PG) has been the Harris standard for characterizing the surface profile of these reflectors due to the technology’s high accuracy, portability, and ability to work in unstable conditions. The technique has been “tried and true” and is familiar to engineering and quality organizations.

During the past year, Nikon Metrology’s Laser Radar (LR) has been evolving into a robust inspection technique that reduces materials and automates the measurement process. In a cost-competitive market of reflector fabrication, Laser Radar offers a promising solution in reducing the recurring labor cost during significant production efforts. To implement this technology, it was necessary for the LR to be compared to what Harris recognizes to be the standard of surface characterization. To be accepted, the surface profile characterization (i.e., RMS) for reflectors must be less or equal to 10 percent when compared to photogrammetry.

This article discusses the LR evaluation techniques used for determining the surface profile of reflectors and whether LR would be a suitable alternative to PG during significant production efforts at Harris.

On a variety of reflector sizes, the surface profile (i.e., RMS) was calculated with both LR and PG. The percent differences between RMS values ranged from 2 to 6 percent. Additionally, the labor hours required to determine the RMS value were reduced 90 percent when an automated program was used. For this application of determining the surface profile of reflectors, LR was a suitable alternative to PG in reducing recurring costs associated with production efforts.

Future investigation will be performed to utilize a target projection system in conjunction with PG. If successful, the target projector would eliminate the need to apply and remove PG targets and would greatly reduce measurement time.

Surface profile characterization

Please note the process and technique used to generate the RMS values for the different methods are Harris-specific; other applications may give different results.

A symmetrical point grid is determined so that the reflector’s surface profile can be calculated. This grid is very labor intensive and must be applied accurately because it will be used as an alignment feature during the surface characterization. The grid is applied in a repeatable sequence and correlates the datum reference points of the production tool. The grid is typically transferred to the surface of the reflector during production. This repeatability is maintained throughout production to achieve an “apples to apples” comparison among the reflectors. After measurement, the data are compared to the theoretical surface, and new Z values are generated for the measured X and Y values. Next, the theoretical Z values are used to generate a deviation, or delta, between the measured and the intended surface. These data are then used for reporting RMS and characterizing the surface profile of the reflector. A requirement of less or equal to 10 percent was determined as the threshold needed for the RMS comparisons.

PG and LR comparison process

To ensure that the study comparison was not jeopardized, it was decided that the reflector would be put into alignment and measured with the LR first. A LR RMS value was then calculated using the predetermined measurement grid. The LR was used immediately afterward to project the point grid onto the surface, which allowed for easy application of PG targets. This method ensured that the same point locations were consistent between both measurement methods. A PG RMS value was then calculated using this applied target grid. Because divulging RMS values is competition-sensitive, the LR and PG RMS will be expressed as a percentage difference. The formula below is used:

It is important to note that comparing the calculated PG and LR RMS is inadequate for determining the relative accuracy of the two technologies because the surface of the reflector is less accurate than either method. It is, however, sufficient for determining whether LR is accurate enough for the production process.

1.3-m reflector

For a 1.3-m reflector (see figure 1), comparison data were captured on serial numbers 16, 17, and 18 during a recent manufacturing build. The comparison study mimicked the 88-point grid used by PG to verify reflector RMS throughout the manufacturing process. Plots were generated from the Z deviations to aid in graphically monitoring the surface of the reflectors. The tracking of peak-to-peak Z values between the two methods was consistent (see figures 2, 3, 4). For serial numbers 16, 17, and 18, the percent difference in RMS values were 5.8 percent, 5.9 percent, and 6.2 percent, respectively.

Figure 1: 1.3-m reflector

Figure 2: 1.3-m reflector, SN 16

Figure 3: 1.3-m reflector, SN 17

Figure 4: 1.3-m reflector, SN 18

1.3-m reflector, 288 grid

To evaluate the LR sensitivity of a denser point grid (288 points), another 1.3-m reflector was used. The denser grid increased the resolution and helped minimize the deviations for RMS and peak-to-peak values. The tracking of peak-to-peak Z values between the two methods was consistent (see figure 5). For this particular reflector, the difference between LR and PG RMS values was 5.6 percent.

Figure 5: 1.3-m reflector, denser grid

2.5-m reflector

The second size chosen for comparison was a 2.5-m panelized reflector (see figure 6). This particular reflector is larger and deeper than the smaller 1.3-m reflector. This reflector was characterized using 320 data points, which represents the current PG process. The same measurement technique, alignment process, and analysis used during the 1.3-m tests were applied to ensure consistency between data sets. The tracking of peak-to-peak Z values between the two methods was consistent (see figure 7). For this particular reflector, the difference between LR and PG RMS values was 1.6 percent.

Figure 6: 2.5-m panelized reflector

Figure 7: 2.5-m reflector

3.8 meter reflector

A third data point was a 3.8-m trailer-based, panelized antenna (see figure 8). This larger reflector was characterized using 500 data points. Again, the same measurement technique, alignment process, and analysis used in the 1.3-m test and the 2.5-m test were applied to ensure consistency between data sets. The tracking of peak-to-peak Z values between the two methods was consistent (see figure 9). For this particular reflector, the difference between LR and PG RMS values was 2.6 percent.

Figure 8: 3.8-m trailer-based, panelized antenna

Figure 9: 3.8-m antenna

Labor savings

A labor-saving analysis was performed on the 2.5-m reflector. The results below are typical, but might vary depending on the size of the reflector. For PG and LR, the following represented the four process steps that were compared:

Photogrammetry

• Setup—Target grid application

• Measurement—Perform photo shoot

• Process data—Generate report and plot

• Cleanup—Remove targets and clean reflector surface

Laser radar

• Setup—Position LR and perform reflector alignment

• Measurement—Perform scan

• Process data—Generate report and plot

• Cleanup—Stow LR

The labor savings is displayed as a relative comparison between PG and LR. The formula below is used:

In figure 10 below, ~ 90-percent time reduction was realized with the use of the LR.

Figure 10: Labor comparison

Most of the PG time was spent applying target, removing targets, and processing data in accordance with Harris’ standard procedures. But data processing time for PG could be greatly reduced via the use of newly developed scripting techniques.

The findings showed that it is possible to perform 100-percent unit inspection with LR and reduce recurring costs compared to the lower rate-sampling approach used with PG. For this application of determining the surface profile of reflectors, Laser Radar was a suitable alternative to photogrammetry in reducing recurring labor associated with a production environment.

Conclusion

For small to medium-size reflectors in a production environment, the use of the LR significantly reduced the recurring labor required to characterize the surface profile (i.e., RMS) of reflectors. This evaluation demonstrated that when compared to PG, LR met the requirement of less than or equal to 10 percent from a dimensional comparison standpoint. In addition to achieving parity in measurement performance to PG, LR achieved significant cycle-time reduction with the use of automated programs. The difference in RMS was 6 percent maximum for small reflectors and substantially smaller for the larger 2.5-m and 3.8-m reflectors. Peak-to-peak Z values measured by LR were consistent when compared to PG. The comparison study satisfied the requirements needed to implement LR in areas of heavy production where cycle time and labor costs are driving factors.

Further investigation is expected using PG and a newly developed target projector, which may further reduce cycle time and labor costs.

About The Authors

Authors Randy Fratena and Charles Mitchell are technical engineers at Harris Corp.’s Government Communications Systems Division (GCSD), one of four divisions within Harris Corp. Harris GCSD conducts advanced research studies, develops prototypes, and produces and supports state-of-the-art, assured communications solutions and information systems that solve the mission-critical challenges of its military and government customers, while serving as the technology base for the company’s diverse commercial businesses. Harris Corp., which also provides tactical radio, microwave, and broadcast products and systems, serves customers in more than 150 countries. For more information, visit www.harris.com.

Click here to watch a video about Laser Radar


CMSC “Call for Papers” for 2011 Coordinate Metrology Systems Conference

December 14, 2010

The Coordinate Metrology Society, the eminent membership association for measurement professionals, today announced their “Call for Papers” in anticipation of their 2011 Coordinate Metrology Systems Conference (CMSC). Their 27th annual event will be held in Phoenix, Arizona from July 25-29, 2011. Metrology professionals from leading manufacturers, science laboratories, and academia are invited to submit abstracts for presentations and technical papers covering industry best practices, scientific research and developments, and successful applications of 3D coordinate measurement systems. The CMSC is the only North American conference dedicated solely to users of portable, high-precision measurement technology used to inspect manufactured and assembled components on the factory floor.

Abstract submissions will be peer-reviewed by the Coordinate Metrology Society and considered for presentation at CMSC 2011. The deadline for abstracts is March 1, 2011. For guidelines or more information about presenting a technical paper at CMSC 2011, contact Michael Raphael, Technical Presentations Coordinator at presentations@cmsc.org. Guidelines for presentations and technical papers can be downloaded at 2011 CMSC Guidelines.

At the 2010 CMSC, 25 expert presentations were delivered by industry leaders from Northrop Grumman, NIST, Lawrence Livermore, National Physical Laboratory (NPL), Spirit AeroSystems, Hitachi Engineering & Services Corp., Harris Corporation, Argonne National Laboratory, ISRO Satellite Centre, Institute of Measurement and Automatic Control, Voith Hydro Inc., Sigma Space Corporation, Royal Institute of Technology, and other companies and educational institutions covering technology, theory, and practice to advance the field of 3D metrology. 

The Coordinate Metrology Society convenes each year to gather information and attend presentations delivered by their peers. Attendees include novice and veteran technology users, service providers, and OEM manufacturers of close-tolerance, portable industrial coordinate measurement systems, software, and peripherals. In the Exhibition Hall, visitors explore the latest in laser projection systems, laser trackers, laser radar, articulating arms, photogrammetry/videogrammetry systems, scanners, and indoor GPS.


High-Quality Inspection with the ShuttlePix Portable Microscope

December 13, 2010

Reprinted from Quality Magazine

The ShuttlePix P-400R Digital Microscope from Nikon Metrology is a portable digital microscope that has a sleek, compact design well suited for onsite use. This new concept in digital microscopy allows for much simpler remote inspection of large samples that previously had been too challenging.

Operators can use the ShuttlePix for inspection, observation, simple measurement and recording of high-resolution images in industrial applications, as well as other practical imaging applications where an object needs to be inspected on site and in its correct position without risk of damage.

Launched opening day at Chicago’s IMTS 2010 show in September, the microscope comes with a built-in four section LED oblique ring light that allows the observer to capture images without shadows by optimizing the light output. It can be operated on a Lithium-ion battery for handheld use. The cordless design allows the operator to bring the microscope to large samples, such as turbine castings, aircraft frames or pipe work that cannot be reached with conventional microscopes.

The technology can be used for a broad range of inspection tasks in aerospace, electronics, automotive, biomedical and other industries.

“The ShuttlePix is truly a portable microscope that can be easily used handheld, which enables the microscope to be brought to locations where conventional microscopes could not be taken,” says Koji Kiribuchi, marketing manager, vision products, Nikon Metrology.

“Previously, samples that were either too large, remote, or part of a large structure had to be sampled, cut or cross-sectioned in order to be analyzed under the microscope. The ShuttlePix enables a nondestructive analysis of samples. Additionally, the ShuttlePix can be used on the production floor without disrupting the manufacturing process. Prior to this, samples had to be brought to QA/QC testing labs, where the microscopes were typically stationed,” says Kiribuchi.

The ShuttlePix is equipped with a 2.5-inch LCD monitor where the operator can frame, focus and capture images.  Images are then saved to SD memory cards to be displayed on a PC for further analysis. The ShuttlePix also features 20x zoom optics, and operators are able to achieve a 20x to 400x magnification range without having to change the objective lens.

The microscope is very easy to operate. Just by holding down the capture button, a “best-shot selector” automatically starts up and saves only the best shot from a string of continuously shot images. There is also automatic selection of optimal camera mode based on the sample. Previous experience with using a microscope is not necessary, since the ShuttlePix operates the same way as a compact digital camera.

Kiribuchi says that Nikon’s ability to bring over its advanced optical technology, combine it with their advanced digital image process technology and package it in a very compact stylish design is one of the key features that makes the portable microscope so innovative.

A motorized focusing stand controller accompanies the ShuttlePix in combination with a 17-inch touch screen monitor that has motorized Z focusing, simple measurement analysis, extended depth of focus (EDF) and three types of stage options for a multitude of applications. Its application software offers 3-D image reconstruction and measurement.

In response to a growing demand for a truly portable microscope that could magnify samples and record and save images as digital files, Nikon started product development two years ago and will start shipping the ShuttlePix in December 2010.

So far, the response has been overwhelmingly positive. Nikon Metrology has received numerous inquiries from potential customers for a multitude of applications and inspection tasks, as well as for personal use. ShuttlePix P-400R will be available individually as a cordless microscope, or as a system unit by adapting onto the motorized focusing stand controller.

Watch a ShuttlePix video

Click here to request more information


Stay out of the Doghouse this Holiday

December 11, 2010

Hey guys, I just came across this video on Circuitmart.com, and thought it was perfect for this time of year.

If any of you are going shopping for your wives or girlfriends this weekend, you’ll want to watch this first.

Take a look.  I think you’ll enjoy it.


Nikon Metrology partners with Measurement Supply Company at Performance Racing Industry Show 2010

December 10, 2010

 

Measurement Supply Company will be featuring a Nikon Metrology CMM portable scanning arm at the show this year in Orlando, Florida.
 
Visit Measurement Supply Company at Booth #5991.
 
 

 

Visit www.nikonmetrology.com to learn more about the portable scanning arm.

 

 

Visit http://www.performanceracing.com/tradeshow/ for more details.

Don’t miss the three biggest business days in motorsports when the worldwide racing industry gathers in Orlando, December 9-11, 2010, for the 23rd Annual Performance Racing Industry Trade Show.

Taking up nearly 1,000,000 square feet, 1000+ companies will display the latest advances in racing products and race engineering. Engine parts, suspension components, data acquisition, safety gear, new metal alloys and coatings, machining equipment, race electronics…it’s all part of the world’s largest racing trade show.

Information reprinted from www.performanceracing.com


Examination and Measurement of Medical Devices and Components

December 9, 2010

Nikon Metrology offers a complete range of examination and measurement services for the inspection of medical devices and components. These include microscopy, manual metrology, automated non-contact video measuring, non-contact geometry inspection, X-ray radiography and computed tomography.

Accurate inspection of small medical components

With medical devices, failure is not an option. Reproducible examination and measurement of key components and specified tolerances play a key role in ensuring the reliable and repeatable performance needed for items such as simple, single-use catheters right through to the most advanced drug delivery systems.  In order to avoid the rejection of rogue batches, examination and measurement methods also need to be able to verify the quality of purchased materials prior to release from inventory, and provide a complete audit trail for regulatory purposes.

Microscopy examination of medical devices

Microscopy is a key tool in the examination of medical devices and components as it provides the means to produce the high-contrast images needed to spot small imperfections on and below the surface of samples such as catheters and surgical blades. It can also prove beneficial in examining failures, to assess whether they are due to a manufacturing error or misuse.

Manual metrology for medical device quality control

Manual metrology provides an accurate means to assess prototypes, check the performance of new injection-molding tools and perform lower-volume quality control checks.

Automated non-contact video measuring of medical components

Automated non-contact video measuring allows multiple measurements to be reliably made on large numbers of small and complex components at a rate that can keep pace with demanding production schedules. With the correct illumination settings, and repeatable and reproducible edge detection, even the edges on dark and clear parts can be correctly refracted, detected and reproducibly measured. Non-contact video measurement can also be used to compare CAD versus actual data and perform real-time SPC.

Non-contact geometry inspection of medical components

For some components, like knee, hip or dental implants and hearing aids, the as-built shape of the component is crucial for fast patient recovery and maximum comfort. State-of-the art digital laser scanners create high-accuracy, high-density 3D digital copies of the part with a minimum of effort. These point clouds can be used for the inspection of the surface geometry.

Color diagrams instantly highlight deviations and facilitate the communication with the production department. Alternatively, these copies can be used to create CAD surface models from components that have been tuned manually or where no CAD file is available.

X-ray radiography and computed tomography for inspection of complex medical devices

Medical devices are highly complex components where critical parts can’t be reached by touch probes or seen by video and laser systems; think about the dimensions of an inhaler chamber or any other drug delivery system. Of course, you want to be sure that all components in a pacemaker are connected properly before it is implanted.

In this case X-ray radiography and computed tomography (CT) is the ideal solution. CT is a non-destructive technique that creates full 3D copies of the test specimen that not only allows dimensional inspection but also fault detection, failure analysis and the assembly inspection of complex mechanisms.

Nikon Metrology offers a wide range of CT solutions that all feature in-house-built X-ray sources that give very sharp, high-resolution images. Real-time radiography enables interactive visual inspection, but automation capabilities are available for the inspection of larger batches.


Precision Engineering Company Invests Shrewdly, Competes Globally

December 8, 2010

Top-line equipment lures high-end customers

Reprinted from Quality Digest

Manufacturing is getting easier in many ways, at least as far as the technology is concerned. For example, machine tools are simpler to program and operate, rapid prototyping means that product development is faster and cheaper than ever, and user-friendly CAD software may even negate the need for physical prototypes entirely. All of this assumes that what you are actually making, or trying to make, is relatively uncomplicated. It’s a different matter, however, if you are building complex multimillion-dollar aerospace systems, such as those engineered by Mecanizados Escribano.

The Madrid-based precision engineering business, which specializes in complex parts for aerospace and defence applications, has invested in a Renishaw REVO five-axis measuring head and probe system. The investment has reduced inspection time by as much as a factor of five, ensuring that quality control and inspection keep up with the company’s high-productivity CNC machine tools.

“When we buy a machine tool we specify all the options,” says company project manager Juan A. Humanes. “But having the best machines is only part of the equation. Our customers demand very rigorous part inspection, which means there’s always the chance that the metrology department can become a bottleneck, especially when the parts are complex and machined to very tight tolerances.”

Exceptional scanning speed and accuracy

The key attribute of the REVO five-axis head is its ability to overcome the limitations of three-axis scanning methods, where any attempt to rapidly move the large mass of a coordinate measuring machine (CMM) results in inertial errors caused by accelerations and decelerations. Therefore, the only possible way to maintain acceptable accuracy in three-axis scanning has been at the expense of measuring speed. However, REVO uses synchronized head and machine motion when scanning, rapidly following changes in part geometry without introducing its own dynamic errors. The CMM is able to move at a constant velocity while measurements are being taken, without affecting accuracy.

“Depending on what the customer requests, we inspect between 10 and 100 percent of machined parts,” explains Humanes. “The Renishaw REVO system, recently fitted to a Metris [now Nikon Metrology] CMM, measures nonprismatic surfaces very quickly, many of which would be difficult or impossible to measure with touch-trigger systems. In some cases, such as a complex avionics chassis for the Typhoon, the REVO has increased our inspection throughput by a factor of five and typically up to 80-percent reduction in time per part.”

REVO also benefits CMM users with infinite head positioning and innovative tip-sensing probe technology, which further improves measurement accuracy by sensing close to the measured surface. This combination of speed, flexibility, and accuracy has proven to give exceptional performance in a wide range of scanning measurement applications, including circle, helix, sweep and gasket scanning, and, if required, rapid single-touch routines.

Expanding to meet increased demand

Any visitor lucky enough to tour the Escribano factory can see the size and significance of the investment required for such production. Humanes reveals it to be between €1 million and €1.5 million ($1.3 – $2 million) a year, and most of the company’s CNC machines are top-end, Japanese or Swiss-built, multipallet, and multi-axis units from Makino, Matsuura, and Mazak; Sodick wire EDMs; and CNC precision grinders from Jung. All of them are the latest models, meticulously maintained and configured to minimize setup and nonmachining time, mostly using Renishaw OMP40 spindle-mounted touch probes and NC4 noncontact laser tool setting systems.

Escribano has outgrown its current building and has designed and built a new facility, where it will relocate in the next few weeks. Until then, the two small rooms adjacent to the main workshop that house the company’s inspection equipment will remain crowded. In the larger of the two rooms, three DEA Global Advance CMMs with Renishaw probes check samples of parts for everything from thermal imaging cameras to components destined for the Joint Strike Fighter. Alongside the main metrology lab is a smaller room housing the company’s largest CMM: a Nikon Metrology LKV equipped with the Renishaw REVO five-axis measuring head and probe system, part of a recent investment in inspection equipment that totalled about €300,000 ($402,000).

For most precision-engineering businesses, the Nikon Metrology and Renishaw REVO combination would be enough to cater to their metrology needs. But Escribano isn’t your typical workshop, and its customers are somewhat more demanding. The company has invested in other advanced metrology systems such as a white-light interferometer microscope for measuring roughness, and a contact profile meter capable of assessing the size and texture of a part’s surface.

Sophisticated expertise and technology

Companies such as Escribano, a privately-owned engineering workshop with the expertise and technology to deliver components and systems for such sophisticated applications, are few and far between. No one at Escribano can or will talk about its customers or their products, but Humanes is happy to discuss what the company is equipped to do and how it does it.

“We specialize in machining complex, five-axis parts in aircraft-grade aluminium, stainless steel, nickel alloys, copper and titanium,” he says. “The only way to be good at this kind of work is to make the necessary investments in technology and people. Our customers can choose between some of the best-equipped suppliers in the world, so we have to make sure we can deliver exactly what they want, when they want it.”

A large proportion of Escribano’s production is for the U.S. defence sector, which probably can choose among more small, privately-owned precision engineering companies than any other country. So why would a U.S. defence contractor choose to outsource some of its most complicated, quality-critical parts to a company in Spain instead of one closer to home?

“Some people might assume that we win business because Spanish labor costs are lower than they would be at a similar, U.S. company,” says Humanes. “But they would be wrong. If that were the case, the work would simply migrate to Asia. The truth is we are competitive because we invest in the best technology, and we train people to high levels. We don’t just benchmark ourselves with competitors in Spain or Europe; we aspire to be the best in the world.”

General precision engineering may, thanks to the technology, be getting easier, but Escribano’s willingness to meet almost any standard of engineering precision means that even during the worst recession in living memory—and the Spanish economy is suffering the effects as acutely as any country’s—this family-owned company is still busy 20 hours a day.


X-ray Irons Out Electronic Flaws at Process Sciences Inc.

December 6, 2010

Process Sciences Inc. (PSI) runs X-ray inspection to trace connectivity issues in electronic circuitry that otherwise remain hidden for the eye. Using intuitive real-time X-ray imaging, PSI collaborates with OEMs and contract assemblers nationwide to reveal and resolve weak points in their PCB manufacturing processes.

Literally looking into electronic boards and devices

Hidden electronic defects that remain undetected at first are often the topic of heated discussions between electronic designers and production engineers. As a consequence, additional prototype rounds are needed to sort out uncertainty about electronic system behavior and robustness. To avoid process delay and extra fabrication cost, electronics assembly suppliers and OEMs rely on PSI to quality-proof their PCB prototype and production samples. PSI has the know-how to inspect, troubleshoot and repair PCBs at a cost that is only a small fraction of the fabrication investment for a new full-functional PCB prototype.

Insight into electronic connectivity issues greatly reduces prototyping effort and manufacturing cost.

“Through electronics inspection at 3M, I learned about the extensive capabilities of Nikon Metrology XT V inspection systems,” says Stephen Schoppe, President of PSI in Leander, Texas. “For us, as an engineering and services company in the electronics industry, it is crucial to have the capability in-house to check PCB boards inside out. By visualizing connectivity failures in electronic devices and circuit boards, or between both, we are able to define the best way to readily provide a reliable fix. Insight into what really causes the problem is essential in optimizing customers’ electronics design and manufacturing practices.”

Real-time navigation and zoom controls provide easy access to the tiniest details inside boards and devices.

PSI’s 5,500 square foot engineering laboratory is equipped with electronics X-ray, rework equipment, microscopes, material validation systems, reballing stations, and other systems. Schoppe says that they organized x-ray inspection such that one system is dedicated to customers and the other to investigations performed by PSI. He marks that most customer projects are related to electronic connectivity issues including wire bonds, solder joints and through-layer vias.”

Efficiently tracing and resolving connectivity issues

The Nikon Metrology XT V system enables us to literally look inside specimens, so that we can trace tricky defects that would otherwise remain buried under chip packages and PCB layers. Using angled imaging with high magnification, we reveal mysterious shorts in the form of minuscule solder dendrites and voids scattered around ball grid array (BGA) connections. In this case, we desolder, reball and reflow the device to reestablish correct and robust electronic connections.”

X-ray traces incomplete vias and helps create alternative routes for these open connections.

Also incomplete vias are typically hard to trace without x-ray. “We use the system’s qualitative imaging and real-time X-ray capabilities to intuitively navigate through the layers of a PCB, by changing position, angle and zoom as desired. When detecting an open caused by an incomplete via, we investigate the surrounding internal structure to create an alternative route for the failing connection.

Schoppe explains that image resolution up to 1 micron provides great insight into internal defects, such as inclusions found in solid metallic material. “In solid-state switches, for example, x-ray helped us identify irregularities inside the welded parts of the components. Similarly, we traced internal cracks in ceramic chip capacitors that were caused by electric stress.”

PSI engineers trace minuscule solder dendrites and voids scattered around the solder balls of BGA devices.

A growing quality threat in the worldwide electronics business are counterfeit chip dies produced cheaply in Far-East countries. PSI identifies an increasing number of counterfeit silicon that yields electronic performance risks. This is another reason why electronics OEMs have their boards verified by PSI before they pay their assembly suppliers.

Lower prototyping expenditure and manufacturing fail rate

Cisco, Flextronics, Schlumberger and St. Jude Medical are among nationwide customers that benefit from PSI’s X-ray related electronics services. Key in PSI’s services offering is supreme x-ray quality, which outperforms the imaging capability of previously installed systems on every single performance characteristic.

On magnified X-ray images, voids and other defects in metallic surfaces immediately attract the attention.

“The impact of top X-ray technology is huge,” Schoppe concludes. “Real-time displays showing angled views in highest resolution prove technical faults and support early defect discovery, reducing prototyping expenditure and manufacturing fail rate. Our technical expertise sharpened in advanced customer X-ray projects attracts new and repeat business for both services and consultancy.”

Click here to watch a video of real-time x-ray inspection of “pillow open” solder defects in BGA. Pause the video at the 0:28 mark….can you find the five open solder joints? Hint: they are perfectly round solder balls overlapping a round mound of solder on the pad. You can see an overlap where the bond should be, it’s shaped like a marquise cut diamond.


Nikon Metrology features MCA II Portable Scanning CMM Arm at the International Motorsports Industry Show

December 3, 2010

 

Full flexibility – Portable productivity
The MCA II, Manual Coordinate measuring Arm, is a precise, reliable and comfortable portable measuring system available in a 6- or 7-axis version. It feels perfectly at home in the metrology lab as well as on the shop floor.

The  MCA II  can  be  equipped  with  a  wide  range of  probing systems  for laser scanning, touch  trigger measurements and  continuous scanning. Its flexibility makes this measurement arm the perfect partner for a wide range of measurement tasks

Learn more about Nikon Metrology’s articulated scanning arm at www.nikonmetrology.com


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